Roadmap Industri Semikonduktor China

Nemu naskah bab 2 dari sebuah buku kajian industri ME     ( terbitan tahun 2000-an? ), dengan judul: “China’Semiconductor Industry”

Salah satu penulisnya: David Hodges, penulis buku     ‘legendaris’: MOS Digital Integrated Circuit Designand Analysis (1980)

Saya tertarik dengan strategi/roadmap yg dipilih dan dilakukan Pemerintah China, dimulai tahun 1995, (not so long ago) utk membangun kemampuan China dalam IC Design dan Industri Wafer Fab dengan rencana sbb. :

==> Sasaran untuk dicapai pada tahun 2000

-> mendirikan 5 perusahaan wafer fab
-> mendirikan 20 buah IC Design Center

==> Peta Tahapan:

-> mulai dgn mass production teknologi 0.8 um
-> pilot-scale / trial production      0.5 um
-> Lab-scale Research & Development    0.35 um

==> Investasi: > $1.2 Bio
==> Mitra Teknologi: NEC

——-( ihsan )—————————————

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Michael Pecht, Weifeng Liu and David Hodges

Project 909

As a major part of China‘s Ninth FYP, to encourage
domestic IC production capability and to reduce
reliance on semiconductor imports, in 1995 China
launched its largest ever IC development project
in the Pudong New Area of Shanghai. W

With an investment of more than $1.2 billion, this
project is the largest project ever undertaken in
China’s electronics industry.

The Pudong Microelectronics Center enterprise is
just one piece of a larger project known as Project
909, sponsored by China’s Ministry of Electronics
Industries (MEI), which merged in 1998 with the
Ministry of Posts and Communications to become the
new Ministry of Information Industries).

The project calls for the establishment of five
major IC production companies and as many as 20
design and development centers by 2000 [Johnson
1999b]. Its primary targets in semiconductors are
to develop advanced 0.3 um chip technology in labs;
produce 0.5 um chips on a trial basis, and massproduce
less sophisticated 0.8 um chips, with a production goal
of 1.2 billion units in the year 2000 and gross sales
reaching 10 billion yuan ($1.2 billion). Shanghai was
chosen as the site for the project because it had
become the center for microelectronics production in
China. I

In 1995, Shanghai plants accounted for 21 percent of
total Chinese production of semiconductors [Simon 1996].
Project 909 started with the development of an 8-inch
0.35 mm wafer manufacturing facility in a joint venture
between Huahong Group and NEC of Japan.

Production began in March 1999 and one year later reached
10,000 wafers per month. Output, primarily DRAM memory
chips, is exported back by NEC to Japan markets.

Plans for several other manufacturing facilities with
similar technological capability have not yet come to
fruition. The limitation has been unavailability of
large capital investments under terms that would maintain
a large degree of Chinese control.

The ultimate goal of Project 909 is to bring 0.35 um very
large-scale integrated circuit (VLSI) technology to bear
on telecommunication and computer-use ICs for both Chinese
and export markets.

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